Specifications: Part number:UFS153 TO USB3.0 IC Package:UFS153 Pin Pitch:0.5mm Pin Count:66pins IC Size:11.5*13mm Main control chip:SM3350 Material & ...
EMMC153 169 EMCP529 EMCP162 189 EMCP221 socket 6 in 1 Data Recovery Tools for Android phone eMMC programmer Socket High Quality This kit is specifical...
BGA132/BGA152 /136/88 to DIP48 Adapter IC Test Socket BGA132 BGA152 Burn in Socket Programmer Socket clamshell Structure Feature and Dimension : a) .....
Product Features: A. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel, etc--eMMC B. Apply to BGA221. C. Accurate positioning on flat bottom ...